Hardware & Systems | Kisaco Research

The Hardware & Systems track at the AI Infra Summit covers the latest developments in semiconductor and systems design, performance, optimization, and efficiency.  

This track is designed for hardware, systems, AI & ML engineers and architects from leading infrastructure vendors, hyperscalers, national laboratories and research facilities.

How Will You Benefit?

Nerd out on a vast array of the world’s most mind-bogglingly advanced hardware designs, with deep-dives on stage, new product launches and real hardware on the exhibition floor.

We’ve been the leading showcase for blisteringly-fast AI hardware since 2018!

Meet and collaborate with systems integrators and the end users and get your tech into the right hands.

See how AI is developing at the model and application layer and stay ahead of the curve.

Supercharge the performance and efficiency of your AI stack. 

Learn about optimization techniques from hardware to software, and upskill your engineers, architects, and developers in hands-on workshops. 

Agenda Highlights:

  • Chip Design Innovations: Advancements in Generative AI, power efficiency, inferencing speeds, neuromorphic hardware, and hardware-software codesign. 

  • Networking: Photonics and Optical interconnect solutions, efficiency advancements, and adoption challenges of new interconnect technologies.  

  • Memory & Storage: On prem, cloud & hybrid storage solutions, software defined memory advancements, scaling memory bandwidth and latency. 

  • Systems Optimization: Hardware & Software co-design, resource utilization, alternative architectures for efficient scaling, & open source full-stack optimization opportunities.  

  • AI Data Center: Integrating next gen technologies, silicon visibility, composable infrastructure, and capacity optimization.  

Confirmed Hardware & Systems Speakers Include:

 

Priya Kesavan

Principal, Azure AI Systems Strategy
Microsoft

Priya Kesavan is an AI Strategy Principal at Microsoft. In her current role, she leads the development of long-term strategies and roadmaps for Microsoft's in-house AI hardware systems. In the past, Priya held several leadership positions in product management for SoC and systems development at Intel and Cisco. Driven by a passion for harnessing AI to address complex real-world challenges and improve user experiences, she is a strong advocate for "AI for good." Priya is also committed to empowering women in technology and AI, spearheading initiatives to foster their growth and advancement.

Priya Kesavan

Principal, Azure AI Systems Strategy
Microsoft

Priya Kesavan

Principal, Azure AI Systems Strategy
Microsoft

Priya Kesavan is an AI Strategy Principal at Microsoft. In her current role, she leads the development of long-term strategies and roadmaps for Microsoft's in-house AI hardware systems. In the past, Priya held several leadership positions in product management for SoC and systems development at Intel and Cisco. Driven by a passion for harnessing AI to address complex real-world challenges and improve user experiences, she is a strong advocate for "AI for good." Priya is also committed to empowering women in technology and AI, spearheading initiatives to foster their growth and advancement. She holds a degree in Computer Engineering from Madras University.

 

 

Steven Woo

Fellow and Distinguished Inventor
Rambus

I was drawn to Rambus to focus on cutting edge computing technologies. Throughout my 15+ year career, I’ve helped invent, create and develop means of driving and extending performance in both hardware and software solutions. At Rambus, we are solving challenges that are completely new to the industry and occur as a response to deployments that are highly sophisticated and advanced.

Steven Woo

Fellow and Distinguished Inventor
Rambus

Steven Woo

Fellow and Distinguished Inventor
Rambus

I was drawn to Rambus to focus on cutting edge computing technologies. Throughout my 15+ year career, I’ve helped invent, create and develop means of driving and extending performance in both hardware and software solutions. At Rambus, we are solving challenges that are completely new to the industry and occur as a response to deployments that are highly sophisticated and advanced.

As an inventor, I find myself approaching a challenge like a room filled with 100,000 pieces of a puzzle where it is my job to figure out how they all go together – without knowing what it is supposed to look like in the end. For me, the job of finishing the puzzle is as enjoyable as the actual process of coming up with a new, innovative solution.

For example, RDRAM®, our first mainstream memory architecture, implemented in hundreds of millions of consumer, computing and networking products from leading electronics companies including Cisco, Dell, Hitachi, HP, Intel, etc. We did a lot of novel things that required inventiveness – we pushed the envelope and created state of the art performance without making actual changes to the infrastructure.

I’m excited about the new opportunities as computing is becoming more and more pervasive in our everyday lives. With a world full of data, my job and my fellow inventors’ job will be to stay curious, maintain an inquisitive approach and create solutions that are technologically superior and that seamlessly intertwine with our daily lives.

After an inspiring work day at Rambus, I enjoy spending time with my family, being outdoors, swimming, and reading.

Education

  • Ph.D., Electrical Engineering, Stanford University
  • M.S. Electrical Engineering, Stanford University
  • Master of Engineering, Harvey Mudd College
  • B.S. Engineering, Harvey Mudd College

 

Gayathri Radhakrishnan

Partner
Hitachi Ventures

Gayathri is currently Partner at Hitachi Ventures. Prior to that, she was with Micron Ventures, actively investing in startups that apply AI to solve critical problems in the areas of Manufacturing, Healthcare and Automotive. She brings over 20 years of multi-disciplinary experience across product management, product marketing, corporate strategy, M&A and venture investments in large Fortune 500 companies such as Dell and Corning and in startups. She has also worked as an early stage investor at Earlybird Venture Capital, a premier European venture capital fund based in Germany.

Gayathri Radhakrishnan

Partner
Hitachi Ventures

Gayathri Radhakrishnan

Partner
Hitachi Ventures

Gayathri is currently Partner at Hitachi Ventures. Prior to that, she was with Micron Ventures, actively investing in startups that apply AI to solve critical problems in the areas of Manufacturing, Healthcare and Automotive. She brings over 20 years of multi-disciplinary experience across product management, product marketing, corporate strategy, M&A and venture investments in large Fortune 500 companies such as Dell and Corning and in startups. She has also worked as an early stage investor at Earlybird Venture Capital, a premier European venture capital fund based in Germany. She has a Masters in EE from The Ohio State University and MBA from INSEAD in France. She is also a Kauffman Fellow - Class 16.

 

Euicheol Lim

Research Fellow, System Architect
SK Hynix

Eui-cheol Lim is a Research Fellow and leader of Solution Advanced Technology team in SK Hynix. He received the B.S. degree and the M.S. degree from Yonsei University, Seoul, Korea, in 1993 and 1995, and the Ph.D. degree from Sungkyunkwan University, suwon, Korea in 2006. Dr.Lim joined SK Hynix in 2016 as a system architect in memory system R&D. Before joining SK Hynix, he had been working as an SoC architect in Samsung Electronics and leading the architecture of most Exynos mobile SoC.

Euicheol Lim

Research Fellow, System Architect
SK Hynix

Euicheol Lim

Research Fellow, System Architect
SK Hynix

Eui-cheol Lim is a Research Fellow and leader of Solution Advanced Technology team in SK Hynix. He received the B.S. degree and the M.S. degree from Yonsei University, Seoul, Korea, in 1993 and 1995, and the Ph.D. degree from Sungkyunkwan University, suwon, Korea in 2006. Dr.Lim joined SK Hynix in 2016 as a system architect in memory system R&D. Before joining SK Hynix, he had been working as an SoC architect in Samsung Electronics and leading the architecture of most Exynos mobile SoC. His recent interesting points are memory and storage system architecture with new media memory and new memory solution such as CXL memory and Processing in Memory. In particular, he is proposing a new computing architecture based on PIM, which is more efficient and flexible than existing AI accelerators, to process generative AI and LLM (large language Model) that is currently causing a sensation.

 

Alex Liu

SVP of Global Business
FuriosaAI

Alex Liu

SVP of Global Business
FuriosaAI

Alex Liu

SVP of Global Business
FuriosaAI
 

Dave Lazovsky

Co-Founder & CEO
Celestial

Dave Lazovsky is the Co-founder and CEO of Celestial AI, the creators of the Photonic FabricTM. Celestial AI, founded in April 2020, has developed the optical interconnectivity technology platform for AI computing.

Dave Lazovsky

Co-Founder & CEO
Celestial

Dave Lazovsky

Co-Founder & CEO
Celestial

Dave Lazovsky is the Co-founder and CEO of Celestial AI, the creators of the Photonic FabricTM. Celestial AI, founded in April 2020, has developed the optical interconnectivity technology platform for AI computing.

Prior to founding Celestial AI, Mr. Lazovsky was a Venture Partner at Khosla Ventures. He has 30 years of experience in the semiconductor industry and over two decades of experience building and leading successful start-ups. In 2004 Mr. Lazovsky founded Intermolecular, a semiconductor and clean energy R&D and Intellectual Property licensing company. He served as the company’s Chief Executive Officer, President and as a member of the board of directors from September 2004 through October 2014.

As President and CEO, Mr. Lazovsky led all aspects of the business through its lifecycle from early-stage start-up to public company. Intermolecular (IMI) went public on the NASDAQ in 2011. He currently has over 80 issued and pending U.S. patents.

Who's Already Signed Up?

Expect to meet:

• Chief Technology Officer
• Chief AI Officer
• Chief Data Officer
• Chief Information Security Officer
• Chief Innovation Officer
• SVP/EVP/VP/Head of:
- AI
- Infrastructure
- Engineering
- Hardware
- Machine Learning
• Chief Architect
• AI Engineer
• Director AI Systems
• Systems Engineer/Architect
• Hardware Engineer/Architect
• Distinguished Engineer/Architect

READY TO JOIN THEM? BOOK YOUR TICKETS HERE